4.55W Poly Solar Cell for 280W Solar Panel Module

Produktbeschreibung

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .



Features:

1.High conversion efficiency resulting in superior power output performance.
2.Outstanding power output even in low light or high temperature conditions
3.Optimized design for ease of soldering and lamination
4.Long-term stability,reliability and performance
5.Output power tolerance of +/-3%

Physical characteristics:



Dimension:156*156mm±0.5mm
Thickness:Wafer(si):200μm±20μm
Cell:240μm±40μm
Front:Silver bus bars;Dark blue/others silicon nitride anti reflection coating
Back:Silver/aluminum bus bars;Full-surface aluminum BSF

Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC


 
ModelEfficiencyPowerMax Power CurrentMin Power CurrentMax Power VoltageShort Circuit CurrentOpen Circuit Voltage

 
Eff(%)Ppm(W)Ipm(A)Ipm(A)Vpm(V)Isc(A)Voc(V)
FS-156P17.80-17.993.897.507.380.5278.040.630
FS-156P17.60-17.793.847.457.320.5257.940.628
FS-156P17.40-17.593.807.407.250.5237.900.629
FS-156P17.20-17.393.767.357.170.5187.860.628
FS-156P17.00-17.193.717.37.100.5167.800.625
FS-156P16.80-16.993.677.257.050.5147.750.623
FS-156P16.60-16.793.637.206.980.5127.700.620
FS-156P16.40-16.593.587.156.900.5107.640.618
FS-156P16.20-16.393.547.16.720.5087.570.616
FS-156P16.00-16.293.497.056.560.5067.350.614
 

FS-156P
ProductPolycrystalline silicon solar cell

 
Dimension156mm×156mm ±0.5mm

 
Thickness(Si)200µm±15µm

 
FrontBlue silicon nitride antireflection coatings 1.4~1.6mm silver busbar ,continuous or discrete 2BB or 3BB

 
BackFull-surface aluminum back-surface field 2.6mm silver continuous or discrete soldering pads

 Solar Cell Production Line


Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

 

Lieferfähigkeit

Verpackung und Versand

Vorlaufzeit:
Hafen:
Verpackungsdetails:

Produktspezifikationen

Type:
Poly
>=1200 pieces

US 0.55

Kontakt


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