Mono 5.2W Solar Cell for 305W. 310W Solar Panel Module

Produktbeschreibung





Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .





Features:

1.High conversion efficiency resulting in superior power output performance.
2.Outstanding power output even in low light or high temperature conditions
3.Optimized design for ease of soldering and lamination
4.Long-term stability,reliability and performance
5.Output power tolerance of +/-3%




Physical characteristics:
Model: 
FSC-M156
Material:
Monocrystalline silicon  
Format:
156*156mm±0.5mm
Cell efficiency: 
18.5%-21%
Maximum power: 
5.2W 
Busbar: 
3BB
Thickness: 
200 μm ± 30 μm
Front (-): 
1.5mm solver bus bars, blue silicon nitride anti-reflecting coating. 
Back (+):
2.3mm wide soldering pads (silver), aluminium back surface filed. 
Current temperature coefficient:
+0.03%/ºC
Voltage temperature coefficient:
-0.32%/ºC
Power temperature coefficient: 
-0.41%/ºC


Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC
 
Characteristics
Efficiency (%): 
20.2%
20.4%
20.6%
20.8%
21.0%
21.2%
Pmpp (W): 
4.94
4.98
5.03
5.08
5.13
5.18
Vmpp (V): 
0.554
0.558
0.561
0.563
0.566
0.568
Impp (A): 
8.902
8.939
8.974
9.023
9.070
9.118
Uocc (V): 
0.653
0.656
0.660
0.663
0.666
0.669
Isc (A): 
8.902
8.939
8.974
9.023
9.606
9.118





Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion
: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.


 

Lieferfähigkeit

Verpackung und Versand

Vorlaufzeit:
Hafen:
Verpackungsdetails:

Produktspezifikationen

Type:
Mono
>=1200 pieces

US 0.65

Kontakt


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